ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide. Imprint: https://www.ers-gmbh.com/legal Privacy policy: https://www.ers-gmbh.com/privacy-policy" title="" class="btn" data-container="body" data-html="true" data-id="203972" data-placement="top" data-toggle="popover" data-trigger="focus" style="color:#0077b5" tabindex="0" data-original-title="ERS electronic GmbH"> 3,321
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Entity types
Location
Stettiner Str. 3/5, 82110 Germering, Germany
Germering
Germany
Employees
Scale: 51-200
Estimated: 59
Engaged corporates
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1 year, 9 months agoMunich-based award-winning manufacturer of thermal management solutions for the semiconductor industry
ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide.
Imprint:
https://www.ers-gmbh.com/legal
Privacy policy:
https://www.ers-gmbh.com/privacy-policy
Learn more about ERS electronic's industry leading thermal solutions for semiconductor testing and packaging, including our patented AirCool® technology.