Entity
  • 3D PLUS

    Created in 1995
  • Social networks

    89 2,815
  • Activities

  • Technologies

  • Entity types

  • Location

    408 Rue Hélène Boucher, 78530 Buc, France

    Buc

    France

  • Employees

    Scale: 201-500

    Estimated: 199

  • SIREN

    402523088
  • Engaged corporates

    16
    2 14
  • Added in Motherbase

    3 years, 6 months ago
Description
  • Value proposition

    OUR MISSION IS THAT YOU ACHIEVE YOURS

    3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and Space qualified Rad Hard vertical Stacks meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.

    Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.

    We offer catalog products and more complex System-In-Package (SiP) solutions that bring breakthrough advantages to our customers’ electronic designs.

    We focus on the demand for high-reliability and high-performance for space-saving technology-driven applications in industrial, computing/telecommunications, security and defense, avionics, medical and space markets.

    MICROELECTRONICS, AEROSPACE, MINIATURIZATION, and TECHNOLOGIE

  • Original language

    OUR MISSION IS THAT YOU ACHIEVE YOURS

    3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and Space qualified Rad Hard vertical Stacks meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.

    Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.

    We offer catalog products and more complex System-In-Package (SiP) solutions that bring breakthrough advantages to our customers’ electronic designs.

    We focus on the demand for high-reliability and high-performance for space-saving technology-driven applications in industrial, computing/telecommunications, security and defense, avionics, medical and space markets.

  • World-leading supplier of advance high-density 3D microelectronic products - 3D PLUS

    3D PLUS products are used in high technology industries such as aerospace, defense, security and avionics.

  • https://www.3d-plus.com/
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