Packaging technology for electronic system integration
Fraunhofer IZM specializes in industry-oriented applied research. With four technology clusters, Fraunhofer IZM covers the entire spectrum of technologies and services necessary for developing reliable electronics and integrating new technology into applications. Our customers are as varied as the applications for electronics. We take on development projects for the automotive industry, healthcare and industrial electronics and even textile companies.
Similarly, Fraunhofer IZM’s customers are extremely diverse, ranging from international electronics corporations to smaller SMEs integrating electronics into their products for the first time. Our spectrum of services caters for all.
The technologies and product solutions developed by Fraunhofer IZM are easily integrated into the industrial manufacturing environment. We provide all our customers with access to equipment compatible with real-life manufacturing conditions. If required, we can even implement the new technologies directly on-site.
Solutions for the Products of Tomorrow: Fraunhofer IZM’s Key Topics
Fraunhofer IZM is international. Our work advances electronic packaging development around the world. The institute’s researchers sit on national and international boards that develop the standards required for innovative integration technologies. We pursue knowledge transfer internationally in cooperation projects with companies and high-profile research institutes around the world.
Fraunhofer IZM offers its staff a platform for qualifying professionally and personally for positions of responsibility within the institute, in the business sector and in other areas of science.
Energie, Photonik, Semiconductors & Sensors, Automobiltechnik / Verkehrstechnik, Medizintechnik, and Industrieelektronik
Das Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM unterstützt Firmen dabei, robuste und zuverlässige Elektronik zu entwickeln, aufzubauen (Electronic Packaging / Aufbau- und Verbindungstechnik) und in die Anwendungsumgebung zu integrieren (System Integration / Systemintegration).
Corporate | Type | Tweets | Articles | |
---|---|---|---|---|
KLA Semiconductors, Semiconductor Manufacturing | KLA Semiconductors, Semiconductor Manufacturing | Other 15 Jan 2020 | | |
CEA Research | CEA Research | Not capitalistic Partnership Event 14 Jan 2021 | | |
Boston Consulting Group (BCG) Consulting, Business Consulting and Services | Boston Consulting Group (BCG) Consulting, Business Consulting and Services | Other 10 Sep 2021 | | |
Fraunhofer-Gesellschaft Research, Research Services | Fraunhofer-Gesellschaft Research, Research Services | Not capitalistic Partnership Event 16 Nov 2021 29 Jul 2023 | | |
Eurostat European Union, Environmental Services | Eurostat European Union, Environmental Services | Other 22 Jun 2023 | | |
Deutsche Telekom Telecoms, Telecommunications | Deutsche Telekom Telecoms, Telecommunications | Other 13 Sep 2023 | | |
Fraunhofer FKIE Research, Research Services | Fraunhofer FKIE Research, Research Services | Other 31 Jan 2023 | | |
imec Research Services | imec Research Services | Not capitalistic Partnership Event 22 Jun 2023 | | |
Bosch Manifacturing tools, Software Development | Bosch Manifacturing tools, Software Development | Other 13 Sep 2023 | | |
Siemens Industry, Automation Machinery Manufacturing | Siemens Industry, Automation Machinery Manufacturing | Other 13 Sep 2023 | |