Value proposition

Since 1968, Amkor has delivered innovative IC packaging solutions with the service & capacity global customers rely on.

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.

Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test.

The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes, dsmbga, advanced packaging, wlcsp, automotive, iot, ai, computing, and memory